Wire Bonder

Oerlikon Esec is one of the world′s leading suppliers of innovative wire bonding solutions.

Owing to our many years of experience, we can satisfy a wide range of customer needs in terms of reliability, assembly productivity, excellent customer support and an excellent cost of ownership.

Our competency is in fulfilling individual customer requirements by offering tailored solutions that enhance the customer's performance.

Esec Wire Bonder 3200

The unchallenged leader in speed, accuracy, bond range and recipe portability

The leading-edge and maintenance-free TY bond head technology of Oerlikon Esec is improved to a hitherto unreached level. With its stiffened air bearings and the more powerful axis motors, the Esec Wire Bonder 3200 reaches best-in-class UPH figures. And, to top it up, when it comes to ultrafine-pitch applications, the Wire Bonder 3200 is not only the fastest, but also the most accurate wire bonder available!

The new Oerlikon Esec Wire Bonder 3200 is keeping its leading position and is preparing the road to future fine-pitch applications.

Features

Revolutionary TY technology In conventional wire bonder design, the bondhead is mounted on an orthogonal x/y stage. By way of contrast, Oerlikon Esec's TY technology links rotational with linear motion to create a theta/y movement. This principle has several advantages. The use of rotation enables the mass to be concentrated near the theta axis, thus reducing the mass moment of inertia. Thanks to this reduction, as well as the pivoting principle employed, higher acceleration can be achieved with less motor force. Another major advantage is the small amount of energy needed to accelerate and brake the bondhead. Less energy means a lower level of vibration and therefore shorter settling times.

Maintenance-free air bearing technology The bondhead of the Oerlikon Esec Wire Bonder 3200 is controlled by high-precision, extremely accurate airbearing technology, the components of which are essentially free of wear and tear. And that results in extremely reliable, maintenance-free performance. This technology has many proven advantages, which is why we chose to make it an integral part of our most innovative Wire Bonder ever. The same technology is also used in the 3200's double indexer and the programmable focus of its optical system

Optimal process capabilities In full production mode, the Oerlikon Esec Wire Bonder 3200 can handle high-speed wire bonding fine pitch applications down to 35 µm. Also, it can accommodate the widest range of leadframe and organic substrate applications. The Esec Wire Bonder 3200 utilizes mechanical and software innovations that have been developed to master the most demanding process challenges. One example is its programmable heater height feature, which ensures orthogonal capillary impact on the bond zero point. And another is its dynamic impact measure, located close to the capillary tip. The 3200's integrated statistical process control system monitors and analyzes all relevant process parameters, and intervenes in the bonding process if necessary.

Ergonomic Human Machine Interface (HMI) The HMI of the Oerlikon Esec Wire Bonder 3200 was developed in collaboration with our customers. The result is a study in ergonomics. Fully compliant with the SEMI S8-0701 safety guideline for ergonomics engineering, this interface enables the 3200's operator to work with the greatest of ease. An optimized keypad ensures fast and simple handling, while providing direct access to 90% of all assist functions.

User-friendly Graphical User Interface (GUI) One of the highlights of the 3200's HMI is its graphical user interface. Designed in accordance with the Sematech GUI Style Guide, it enables operators to work with ease and, thanks to its unique multi-lingual capability, with greater independence. Furthermore, operators in need of assistance can utilize the various pre-packaged help functions and explanatory video sequences.