Equipment Use in Front of Line

In Front of Line (FOL), there are three main process to assemble the unit package. The main process are:

1. Die Preparation (Die prep)

2. Die Attach (DA)

3. Wire Bond (WB)

In Die prep area, there are three main process.

1. Wafer Back Grinding

2. Wafer Mount

3. Wafer Saw.

Die Attach Equipment.

There are so many type die attach equipment in the market. The famous die attach equipments are ESEC, ALphasem, ASM, Renesas and Panasonic.

Renesas Die Bonder DB-730AC

ASM Die Bonder AD898

ESEC Die Bonder 2008

Wire Bonder Equipment

There are so many wire bonder equipment in the market. The famous wire bonders are KNS, ASM, KAIJO.

KNS1488turbo

KNS Maxum

ASM AD339Eagle