Sunday, September 23, 2007

DataCon 2200



The 2200 apm Multi Chip Die Bonder is the current industry standard based on Datacon's previous PPS 2200 Multi Chip Die Bonder platform, a revolutionary modular system introduced in 1995. The Datacon 2200 apm provides users with extraordinary flexibility with minimum space requirements. Whatever connection technologies you choose (flip chip, die attach, or a combination of both) the conversion between different applications is done fast and simply. The 2200 apm was developed specifically for the demanding advanced packaging market.

Saturday, September 15, 2007

Flip Chip

WHAT IS FLIP CHIP?

Flip chip microelectronic assembly is the direct electrical connection of face-down (hence, "flipped") electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. In contrast, wire bonding, the older technology which flip chip is replacing, uses face-up chips with a wire connection to each pad.

Flip chip components are predominantly semiconductor devices; however, components such as passive filters, detector arrays, and MEMs devices are also beginning to be used in flip chip form. Flip chip is also called Direct Chip Attach (DCA), a more descriptive term, since the chip is directly attached to the substrate, board, or carrier by the conductive bumps.

IBM introduced flip chip interconnection in the early sixties for their mainframe computers, and has continued to use flip chip since then. Delco Electronics developed flip chip for automotive applications in the seventies. Delphi Delco currently places over 300,000 flip chip die per day into automotive electronics. Most electronic watches, and a growing percentage of cellular phones, pagers, and high speed microprocessors are assembled with flip chip.

Worldwide flip chip consumption is over 600,000 units per year, with a projected annual growth rate of nearly 50% per year. Semiconductor manufacturers currently bump for flip chip assembly about 3% of wafers produced, and are expected to be bumping 10% within a few years.