Wire Bonder

Oerlikon Esec is one of the world′s leading suppliers of innovative wire bonding solutions.

Owing to our many years of experience, we can satisfy a wide range of customer needs in terms of reliability, assembly productivity, excellent customer support and an excellent cost of ownership.

Our competency is in fulfilling individual customer requirements by offering tailored solutions that enhance the customer's performance.

Esec Wire Bonder 3200

The unchallenged leader in speed, accuracy, bond range and recipe portability

The leading-edge and maintenance-free TY bond head technology of Oerlikon Esec is improved to a hitherto unreached level. With its stiffened air bearings and the more powerful axis motors, the Esec Wire Bonder 3200 reaches best-in-class UPH figures. And, to top it up, when it comes to ultrafine-pitch applications, the Wire Bonder 3200 is not only the fastest, but also the most accurate wire bonder available!

The new Oerlikon Esec Wire Bonder 3200 is keeping its leading position and is preparing the road to future fine-pitch applications.

Features

Revolutionary TY technology In conventional wire bonder design, the bondhead is mounted on an orthogonal x/y stage. By way of contrast, Oerlikon Esec's TY technology links rotational with linear motion to create a theta/y movement. This principle has several advantages. The use of rotation enables the mass to be concentrated near the theta axis, thus reducing the mass moment of inertia. Thanks to this reduction, as well as the pivoting principle employed, higher acceleration can be achieved with less motor force. Another major advantage is the small amount of energy needed to accelerate and brake the bondhead. Less energy means a lower level of vibration and therefore shorter settling times.

Maintenance-free air bearing technology The bondhead of the Oerlikon Esec Wire Bonder 3200 is controlled by high-precision, extremely accurate airbearing technology, the components of which are essentially free of wear and tear. And that results in extremely reliable, maintenance-free performance. This technology has many proven advantages, which is why we chose to make it an integral part of our most innovative Wire Bonder ever. The same technology is also used in the 3200's double indexer and the programmable focus of its optical system

Optimal process capabilities In full production mode, the Oerlikon Esec Wire Bonder 3200 can handle high-speed wire bonding fine pitch applications down to 35 µm. Also, it can accommodate the widest range of leadframe and organic substrate applications. The Esec Wire Bonder 3200 utilizes mechanical and software innovations that have been developed to master the most demanding process challenges. One example is its programmable heater height feature, which ensures orthogonal capillary impact on the bond zero point. And another is its dynamic impact measure, located close to the capillary tip. The 3200's integrated statistical process control system monitors and analyzes all relevant process parameters, and intervenes in the bonding process if necessary.

Ergonomic Human Machine Interface (HMI) The HMI of the Oerlikon Esec Wire Bonder 3200 was developed in collaboration with our customers. The result is a study in ergonomics. Fully compliant with the SEMI S8-0701 safety guideline for ergonomics engineering, this interface enables the 3200's operator to work with the greatest of ease. An optimized keypad ensures fast and simple handling, while providing direct access to 90% of all assist functions.

User-friendly Graphical User Interface (GUI) One of the highlights of the 3200's HMI is its graphical user interface. Designed in accordance with the Sematech GUI Style Guide, it enables operators to work with ease and, thanks to its unique multi-lingual capability, with greater independence. Furthermore, operators in need of assistance can utilize the various pre-packaged help functions and explanatory video sequences.

Die Bonder 2008 hSplus

Overview

The Die Bonder 2008 hSplus is the successful combination of the speed and reliability of the proven high-volume 2008hS platform with the flexibility and accuracy of the award-winning high-end 2008 xP platform.

The ultra fast vision system together with the enhanced Pick & Place enable production runs of 13,000 units per hour. The 2008 hSplus is the ultimate epoxy die bonder with regards to handling metal lead frames, substrates, thin die, stacked die and wafer back side lamination. Of course this bonder family handles high-end applications on BGA substrates and " to 12" wafers.
The intelligent set-up procedure guarantees repeatable constant bonding quality while the ergonomic human-machine interface (HMI) with its user-friendly graphical user interface GUI makes operating this equipment a real pleasure.

Features

Highest speed at highest accuracy

In addition to the drastically increased speed of the new 'pick-and-place', the Die Bonder 2008 hSplus features an improved control system and a new ultra-fast vision module. These cutting edge features enable the highest accuracy imaginable. The incredible accuracy does not interfere with the tremendous speed. Even when making use of the optical bond centering, a staggering production rate of 10,000 units per hour is reached - whereas 13,000 units per hour (UPH) can be achieved with high-volume production runs.

Application range

The Die Bonder 2008 hSplus offers the widest application range that one can ask for. Be it discrete epoxy packages with small dies, QFN or large dies on BGA substrates. Wafer size is no issue, since the 2008 hSplus handles up to 300 mm.
The flexible 2008 hSplus combines unbelievable productivity rates with highest quality levels.

Process capability

The ever-changing technology requirements within the back end segment necessitate equipment with the highest degree of flexibility and the capability to handle new processes. The Die Bonder 2008 hSplus offers all that and more. Take for example wafer backside lamination, thin die and stacked die - to name just a few!

Specification

Productivity	up to 13,000 UPH (depending on configuration and application)
Bonding accuracy	37.5µm @ 3 sigma 25.0µm @ 3 sigma (with optional optical bond centering)
Lead frame types	metal lead frames (e.g. SOT, SOIC, TSOP and QFN) organic substrates (e.g. BGA, Flex BGA, Singulated BGA, ceramics)
Lead frame / substrate sizes	length: 120-260mm width: 9-90mm thickness: 0.1-0.4mm pitch: max. 80mm
Matrix positions	max. 12,000 positions per strip max 3,000 positions per matrix)
Wafer size	up to 12"
Die size	10 × 10 mils to 1x1" (0.25 × 0.25mm to 25.4 × 25.4mm)

Options

Process Modules Programmable Pneumatic Dispenser Flexible Programmable Dispenser Small Die Kit Heated Process Positions (on request)

Vision Systems

• Optical Bond Centering
  
• Parallel Pre-Bond IQC (Integrated Quality Control and Rejected Pad Detection)
  
• Optical Dispense Centering (Integrated Quality Control and Rejected Pad Detection)
  
• Post-Bond IQC

Material Handling

• Wafer size up to 12"
  
• Input Magazine Handler
  
• Dual Input Handler

Safety

• Safety Cover (on request)

Miscellaneous Options

• Wafer Mapping Package
• Integrated Wafer Map Conversion Package
  
• Lead Frame Marking Unit
  
• Die Bonder Link Module (on request)
  
• Non-interruptible Power Supply
  
• Communication Package (host)

Applications

Highest flexibility is a key requirement in today´s dynamic semiconductor industry.

The speed, flexibility and wide product range of the Die Bonder 2008 hSplus enable one and the same machine to feed different production lines. The 2008 hSplus handles lead frame applications like SOT, SOIC, TSOP, PLCC, QFP, QFN/MLF right up to BGA substrates.

The 2008 hS ^plus platform is laid out to fulfill all known customer-specific bonding requirements and is ready to meet future assembly trends.

Training

Epoxy Die Bonder structured training:

Maximizing the Epoxy Die Bonder's effectiveness, improving customer manufacturing quality and throughput, as well as reducing downtime and maintenance costs, are the key objectives of this training program.

With these customer requirements in mind, Oerlikon Esec developed a new performance-based equipment training (PBET) program focused on operation, production engineering, equipment engineering and process levels. PBET emphasizes skill-mastery teaching, which requires an adequate amount of time for trainees to learn new technologies that are clearly defined in a course outline. Aside from learning pure theory, participants also perform lab assignments to reinforce specific machine skills. This training course culminates in the issuance of a certificate of achievement if all tests have been completed successfully.

For customers preferring a more selective training program, Oerlikon Esec offers a modular learning approach in coordination with the training department at Oerlikon Esec Headquarters. Successful completion of these courses earns the trainee a letter of participation.

Another option is the "customer trainer" educational course that enables customers to establish their own training center with their own qualified employees.

The courses can be attended at the training center at Singapore or at Oerlikon Esec Headquarters in Switzerland as well as at a specific customer site. Classes are limited to four attendees, in order to maximize the learning experience for each trainee.

All of Oerlikon Esec's professional trainers hold a certificate of achievement in PBET skills and are highly experienced in the field of epoxy technology.

For further information, please contact one of the Oerlikon Esec Customer Service Centers.