Strasbaugh 7AA wafer grinder

Axus Technology - CMP Equipment, Post-CMP Cleaning and Wafer Grinding Equipment
Axus Technology focuses on providing leading edge equipment and process solutions for surface processing applications, including Chemical Mechanical Planarization (CMP), post-CMP cleaning equipment and wafer grinding processes. Axus Technology offers refurbished equipment, sales of spare parts and assemblies, installation and service support, process development services and equipment engineering services.

SEMICONDUCTOR AND MEMS PROCESS EQUIPMENT FOR CMP AND BACK GRINDING PROCESSES
Axus Technology delivers semiconductor and MEMS process equipment for use with CMP processes, wafer polishing, post-CMP cleaning and wafer grinding. The equipment is either new or refurbished and operates to original OEM specifications. Each tool is provided with a source inspection at our Chandler, Arizona facility, and is packaged with installation and warranty support.
Axus maintains an inventory of processing tools available, which are refurbished and configured to customer specifications.
CMP Tools:
IPEC 472 and IPEC 372M
IPEC 776, Orbital Polisher
Applied Materials Mirra
Strasbaugh 6DSSP
Strasbaugh 6EC
Post-CMP Cleaning Tools:
OnTrak DSS 200 - series 0, 1, and 2
Wafer Grinding Tools:
Strasbaugh 7AF
Strasbaugh 7AA
Disco DFG841
Additionally, all tools can be configured to accommodate various materials, as well as various substrate shapes and sizes.

CMP TOOLS, CLEANING EQUIPMENT AND WAFER GRINDING TOOLS
Axus Technology maintains an extensive catalogue of spare parts and assemblies for the support of CMP tools, post-CMP cleaning equipment and wafer grinding tools. Many of these parts have been provided by the original equipment manufacturer.
The broad array of available parts includes various consumable parts. Parts and assemblies are new and configured specifically for use with these tools.
The technical support team at Axus is composed of engineers and technicians with extensive OEM experience. Axus offers a variety of support programs, including on-call support, service contracts and periodic maintenance programs. The Axus Technology team can also refurbish and upgrade customer tools in our Chandler, Arizona facility.

nTellect 200mm Wafer Grinder

Advanced Wafer Grinding for Semiconductor, Data Storage, SOI, LED, and R&D



















The first to introduce a fully-automatic infeed rotary surface grinder for semiconductor wafers, Strasbaugh continues its leadership with the unique nTellect® wafer grinder.

nTellect Benefits
Reduced sub-surface damage
Improved surface finish
Repeatable thickness control
Low cost
Well-suited for a broad range of applications, including hard materials

nTellect Technologies
Tapeless BackgrindingTM
In-feed technology
In-situ thickness control
Force adaptive grinding
Linear traversing grind spindles
Automated process control
Thin wafer handling

nTellect Applications
Integrated Circuit Backgrinding
SOI (Silicon on Insulator)
Prime Wafers
GaAs (Gallium Arsenide)
LiNbO3 (Lithium Niobate)
AlTic (Aluminum Titanium Carbide for Read/Write Heads)
Glass
Sapphire
Quartz

Reduced Sub-Surface Damage
Strasbaugh's innovative nTellect Grinder incorporates near-frictionless, force-sensitive infeed mechanics with an intelligent control system. Rather than force-feeding the grinding wheels at fixed feed rates, nTellect's force adaptive, infeed system design allows the grinding wheel dynamics to determine the precise stock removal rate. This increases wafer strength and reduces wafer breakage.

Improved Surface Finish
nTellect's ultra-stiff air bearing spindles, sub-micron feed rates and rigid tool construction make mirror finishes possible. Combine this with Strasbaugh's complete selection of advanced diamond wheels, and users can achieve the surface finish required for their specific process.

Repeatable Thickness Control
nTellect's in-situ digital measurement probes provide real time thickness measurements to the intelligent control system. The effects of thermal expansion and diamond wheel wear are eliminated, thus ensuring accurate, consistent wafer thicknesses, which eliminates costly re-work.

Linear Traversing Grind Spindles
The unique linear traversing grind spindles alternate between coarse grinding, dual grinding, and fine grinding. The grind spindles move on precise, preloaded roller bearings that provide smooth, rapid motion. The wafer remains on the same work spindle during grinding to reduce wafer handling and optimize throughput.

State-of-the-Art Technologies
nTellect is now offered with two new technologies: Tapeless Backgrinding and ultra-fine grit grind wheels. Tapeless Backgrinding eliminates the need for tape and dramatically reduces grinding costs. The ultra-fine grit grind wheels enhance die strength and improve surface finish, making them well-suited for the most demanding thin wafer applications.

Select Coat® SL-940E

Powerful Process Control for Conformal Coating

Asymtek’s Select Coat® 940 Series conformal coating system is designed to provide the highest quality and productivity for automated coating processes.
The SL-940E is a high-speed, high-accuracy coating system with integrated, closed-loop process control that ensures superior coating quality. Process parameters are recorded and traceable through Easy Coat® (ECXP) software running on Windows® XP operating system.
Fluid and air pressure are set and monitored through software-controlled electronic regulators. A complete process history can be maintained in ECXP log files for these critical parameters.
A wide range of process parameters can be monitored for statistical process control, including Asymtek’s Laser Fan Width Control, Viscosity Control System, Bar Code System, and Flow Monitoring. The processes are automatically maintained within limits and process status is logged for traceability. This information can be exchanged with customer-specific Factory Information Systems (FIS).

ECXP software, together with an optional vision system, makes teaching your coating program much easier. Pattern recognition software is also available.
Productivity is maximized with ECXP software and machine design. The SL-940E system operates at 1g peak accelerations, is capable of velocities of 1 meter per second, and can accommodate product sizes up to 500 mm.
The SL-940E system has been independently tested and certified for compliance with relevant safety standards including CE and SEMI.

Features

- High-speed, high-accuracy coating system delivers higher productivity
- Powerful process controls ensure coating quality, such as Fan Width Control that automatically adjusts for viscosity variations during the coating process
- Advanced monitoring provides traceability
- Programming is made easier with the optional camera and pattern recognition system
- Downdraft ventilation provides an efficient path for VOC removal
- Designed with stainless steel surfaces, the system is easy to clean and resistant to strong agents
- Integrated electronic controls and software for a wide variety of Asymtek applicators