Semiconductor Equipment

Wire Bonder 3200

2009-03-09T01:26:00.000-07:00

Tomorrow’s speed and technology at your fingertips The cutting-edge, maintenance-free TY bond head technology of Oerlikon Esec has been improved to a hitherto unrivaled level. With its stiffened air bearings and the more powerful axis motors, the Wire Bonder 3200 reaches best-in-class UPH figures. And as if that were not impressive enough, when it comes to ultra fine pitch applications, the Wire Bonder 3200 is not only the fastest, but also the most accurate wire bonder available.

The bond range has been increased and the teaching and process observation techniques refined. A new optional high-resolution vision system was also developed specifically for ultrafine pitch applications. With all of these improved features and the resulting increase in speed, accuracy and process capability, the Wire Bonder 3200 is ready to take on all the latest packaging technologies.

But improvements haven’t stopped there. Oerlikon Esec’s Wire Bonder 3200 has been equipped with a dual clamp material feeding system which drastically increases the UPH output, in particular with low pin count devices, while the new dual heater cartridges improve the temperature distribution with very wide strips. All this is proof enough that the Wire Bonder 3200 is still leading the field and is, already today, setting future industry standards in fine pitch applications.

Best process capabilities:
The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities, with unprecedented placement accuracy, over the entire bond range.

The newly developed non-stick detection recognizes bonding failure on grounded and non-grounded devices. This measurement method reliably monitors the bonding of very sensitive devices, without any damage whatsoever to the device.

A dual cartridge programmable heater further extends the operational area of the Wire Bonder 3200. The improved heating provides uniform temperature distribution for wide substrates over the entire bond range. In addition to the heater height feature, the material feeding system (indexer) incorporates an adjustable rail height. This extends the application range of the Wire Bonder 3200 to thick substrates and reduces the conversion times to boat applications drastically.

Oerlikon Esec’s engineers have also raised the process capability level for long-loop and ultra low loop applications, as well as stack-die and low-k bonding, to an all-time high.

Best bond head technology:
The revolutionary and now wellestablished pivoting bond head with its maintenance-free air bearing have been given a significant performance boost. First of all the three axes were given more powerful motors. This improvement provides the bond head with the highest possible acceleration capacity and working speeds.

Then, as a second major improvement, the air bearing was substantially stiffened leading to a considerable reduction in air consumption. Thanks to the perfectly balanced design of the axes, where all motor forces are in line with the system’s center of gravity, vibration is virtually eliminated. When applied to ultra fine pitch applications, both of these features contribute to the unequalled placement accuracy at worldrecord speeds.

Last but not least, the Y bond range has been increased to handle widest substrates. This is an additional advantage that helps to maximize the throughput with all known applications. In short, the redesigned, more powerful and maintenance-free bond head with its programmable auto focus optical system is a highly economical solution for overcoming current productivity limitations.

In comparison to a conventional orthogonal X/Y-stage, Oerlikon Esec’s superior air bearing-based TY technology eliminates disturbing slip-stick effects and therefore has the greatest potential with regard to speed, accuracy and future applications.

Best vision imaginable:
The optional high-resolution vision system of the Wire Bonder 3200 has been designed especially for demanding ultra fine pitch applications. It provides twofold resolution and magnification, without compromising on reliability or speed. With this option, teaching of ultra fine pitch pads is significantly more accurate and the visual ball inspection system is more reliable than ever.

Best production output:
The improved indexer has two independent clamps on a linear motor for fast material feeding. While one of the clamps continuously pushes out the bonded material, the other feeds unbonded material to the processing area. This makes a dramatic improvement to the material flow. Together with the shorter indexing time, this results in a large increase to the UPH for low pin count devices.

Best graphical user interface:
One of the highlights of the Wire Bonder 3200’s HMI is the graphical user interface. With various help functions and explanatory on-screen video sequences, it enables operators to work with ease and also, thanks to its unique multilingual capability, with greater independence. More than 90 percent of all assist functions are directly accessible via the keyboard.

Industry’s only 35 µm pitch recipe transfer capability
Oerlikon Esec is the only supplier worldwide to offer proven recipe portability from machine to machine – right down to 35 µm!

Highest speed and accuracy:
Oerlikon Esec’s Wire Bonder 3200 is the fastest and most accurate wire bonder available today. This is especially true for ultra fine pitch packages and low pin count devices. The Wire Bonder 3200 is made for the most demanding processes, such as ultra low-loop, stacked-die and lowk applications. It’s the industry’s top performer!

Highest productivity and yield:
In addition to having an increased Y bond range, the Wire Bonder 3200 also offers ultra fine pitch capability with highest possible accuracy over the entire bonding area. The redesigned heater ensures uniform temperature distribution, even with the widest substrates. All this contributes to ultrastable process quality over the entire working range.

Highest resolution vision:
The Wire Bonder 3200 sets the new standard for ultra fine pitch applications, and can be optionally equipped with a high-resolution vision system offering twofold magnification. The clear and detailed image helps to avoid teaching errors, and the visual ball inspection is designed to deal with even the smallest of bonding applications. The vision system operates with wellproven, programmable autofocus technology.

Wire Bonder

2008-11-01T22:47:00.000-07:00

Oerlikon Esec is one of the world′s leading suppliers of innovative wire bonding solutions.

Owing to our many years of experience, we can satisfy a wide range of customer needs in terms of reliability, assembly productivity, excellent customer support and an excellent cost of ownership.

Our competency is in fulfilling individual customer requirements by offering tailored solutions that enhance the customer's performance.

Esec Wire Bonder 3200

The unchallenged leader in speed, accuracy, bond range and recipe portability

The leading-edge and maintenance-free TY bond head technology of Oerlikon Esec is improved to a hitherto unreached level. With its stiffened air bearings and the more powerful axis motors, the Esec Wire Bonder 3200 reaches best-in-class UPH figures. And, to top it up, when it comes to ultrafine-pitch applications, the Wire Bonder 3200 is not only the fastest, but also the most accurate wire bonder available!

The new Oerlikon Esec Wire Bonder 3200 is keeping its leading position and is preparing the road to future fine-pitch applications.

Features

Revolutionary TY technology

In conventional wire bonder design, the bondhead is mounted on an orthogonal x/y stage. By way of contrast, Oerlikon Esec's TY technology links rotational with linear motion to create a theta/y movement. This principle has several advantages.
The use of rotation enables the mass to be concentrated near the theta axis, thus reducing the mass moment of inertia. Thanks to this reduction, as well as the pivoting principle employed, higher acceleration can be achieved with less motor force.
Another major advantage is the small amount of energy needed to accelerate and brake the bondhead. Less energy means a lower level of vibration and therefore shorter settling times.

Maintenance-free air bearing technology

The bondhead of the Oerlikon Esec Wire Bonder 3200 is controlled by high-precision, extremely accurate airbearing technology, the components of which are essentially free of wear and tear. And that results in extremely reliable, maintenance-free performance.
This technology has many proven advantages, which is why we chose to make it an integral part of our most innovative Wire Bonder ever. The same technology is also used in the 3200's double indexer and the programmable focus of its optical system

Optimal process capabilities

In full production mode, the Oerlikon Esec Wire Bonder 3200 can handle high-speed wire bonding fine pitch applications down to 35 µm. Also, it can accommodate the widest range of leadframe and organic substrate applications.
The Esec Wire Bonder 3200 utilizes mechanical and software innovations that have been developed to master the most demanding process challenges. One example is its programmable heater height feature, which ensures orthogonal capillary impact on the bond zero point. And another is its dynamic impact measure, located close to the capillary tip.

The 3200's integrated statistical process control system monitors and analyzes all relevant process parameters, and intervenes in the bonding process if necessary.

Ergonomic Human Machine Interface (HMI)

The HMI of the Oerlikon Esec Wire Bonder 3200 was developed in collaboration with our customers. The result is a study in ergonomics. Fully compliant with the SEMI S8-0701 safety guideline for ergonomics engineering, this interface enables the 3200's operator to work with the greatest of ease. An optimized keypad ensures fast and simple handling, while providing direct access to 90% of all assist functions.

User-friendly Graphical User Interface (GUI)

One of the highlights of the 3200's HMI is its graphical user interface. Designed in accordance with the Sematech GUI Style Guide, it enables operators to work with ease and, thanks to its unique multi-lingual capability, with greater independence. Furthermore, operators in need of assistance can utilize the various pre-packaged help functions and explanatory video sequences.

Die Bonder 2008 hSplus

2008-11-01T22:41:00.000-07:00

Overview

The Die Bonder 2008 hSplus is the successful combination of the speed and reliability of the proven high-volume 2008hS platform with the flexibility and accuracy of the award-winning high-end 2008 xP platform.

The ultra fast vision system together with the enhanced Pick & Place enable production runs of 13,000 units per hour. The 2008 hSplus is the ultimate epoxy die bonder with regards to handling metal lead frames, substrates, thin die, stacked die and wafer back side lamination. Of course this bonder family handles high-end applications on BGA substrates and " to 12" wafers.
The intelligent set-up procedure guarantees repeatable constant bonding quality while the ergonomic human-machine interface (HMI) with its user-friendly graphical user interface GUI makes operating this equipment a real pleasure.

Features

Highest speed at highest accuracy

In addition to the drastically increased speed of the new 'pick-and-place', the Die Bonder 2008 hSplus features an improved control system and a new ultra-fast vision module. These cutting edge features enable the highest accuracy imaginable. The incredible accuracy does not interfere with the tremendous speed. Even when making use of the optical bond centering, a staggering production rate of 10,000 units per hour is reached - whereas 13,000 units per hour (UPH) can be achieved with high-volume production runs.

Application range

The Die Bonder 2008 hSplus offers the widest application range that one can ask for. Be it discrete epoxy packages with small dies, QFN or large dies on BGA substrates. Wafer size is no issue, since the 2008 hSplus handles up to 300 mm.
The flexible 2008 hSplus combines unbelievable productivity rates with highest quality levels.

Process capability

The ever-changing technology requirements within the back end segment necessitate equipment with the highest degree of flexibility and the capability to handle new processes. The Die Bonder 2008 hSplus offers all that and more. Take for example wafer backside lamination, thin die and stacked die - to name just a few!

Specification

Productivity	up to 13,000 UPH (depending on configuration and application)
Bonding accuracy	37.5µm @ 3 sigma 25.0µm @ 3 sigma (with optional optical bond centering)
Lead frame types	metal lead frames (e.g. SOT, SOIC, TSOP and QFN) organic substrates (e.g. BGA, Flex BGA, Singulated BGA, ceramics)
Lead frame / substrate sizes	length: 120-260mm width: 9-90mm thickness: 0.1-0.4mm pitch: max. 80mm
Matrix positions	max. 12,000 positions per strip max 3,000 positions per matrix)
Wafer size	up to 12"
Die size	10 × 10 mils to 1x1" (0.25 × 0.25mm to 25.4 × 25.4mm)

Options

Process Modules

Programmable Pneumatic Dispenser
Flexible Programmable Dispenser
Small Die Kit
Heated Process Positions (on request)

Vision Systems

Optical Bond Centering
Parallel Pre-Bond IQC (Integrated Quality Control and Rejected Pad Detection)
Optical Dispense Centering (Integrated Quality Control and Rejected Pad Detection)
Post-Bond IQC

Material Handling

Wafer size up to 12"
Input Magazine Handler
Dual Input Handler

Safety

Safety Cover (on request)

Miscellaneous Options

Wafer Mapping Package
Integrated Wafer Map Conversion Package
Lead Frame Marking Unit
Die Bonder Link Module (on request)
Non-interruptible Power Supply
Communication Package (host)

Applications

Highest flexibility is a key requirement in today´s dynamic semiconductor industry.

The speed, flexibility and wide product range of the Die Bonder 2008 hSplus enable one and the same machine to feed different production lines. The 2008 hSplus handles lead frame applications like SOT, SOIC, TSOP, PLCC, QFP, QFN/MLF right up to BGA substrates.

The 2008 hS ^plusplatform is laid out to fulfill all known customer-specific bonding requirements and is ready to meet future assembly trends.

Training

Epoxy Die Bonder structured training:

Maximizing the Epoxy Die Bonder's effectiveness, improving customer manufacturing quality and throughput, as well as reducing downtime and maintenance costs, are the key objectives of this training program.

With these customer requirements in mind, Oerlikon Esec developed a new performance-based equipment training (PBET) program focused on operation, production engineering, equipment engineering and process levels. PBET emphasizes skill-mastery teaching, which requires an adequate amount of time for trainees to learn new technologies that are clearly defined in a course outline. Aside from learning pure theory, participants also perform lab assignments to reinforce specific machine skills. This training course culminates in the issuance of a certificate of achievement if all tests have been completed successfully.

For customers preferring a more selective training program, Oerlikon Esec offers a modular learning approach in coordination with the training department at Oerlikon Esec Headquarters. Successful completion of these courses earns the trainee a letter of participation.

Another option is the "customer trainer" educational course that enables customers to establish their own training center with their own qualified employees.

The courses can be attended at the training center at Singapore or at Oerlikon Esec Headquarters in Switzerland as well as at a specific customer site. Classes are limited to four attendees, in order to maximize the learning experience for each trainee.

All of Oerlikon Esec's professional trainers hold a certificate of achievement in PBET skills and are highly experienced in the field of epoxy technology.

For further information, please contact one of the Oerlikon Esec Customer Service Centers.

Strasbaugh 7AA wafer grinder

2008-06-28T03:58:00.000-07:00

Axus Technology - CMP Equipment, Post-CMP Cleaning and Wafer Grinding Equipment
Axus Technology focuses on providing leading edge equipment and process solutions for surface processing applications, including Chemical Mechanical Planarization (CMP), post-CMP cleaning equipment and wafer grinding processes. Axus Technology offers refurbished equipment, sales of spare parts and assemblies, installation and service support, process development services and equipment engineering services.

SEMICONDUCTOR AND MEMS PROCESS EQUIPMENT FOR CMP AND BACK GRINDING PROCESSES
Axus Technology delivers semiconductor and MEMS process equipment for use with CMP processes, wafer polishing, post-CMP cleaning and wafer grinding. The equipment is either new or refurbished and operates to original OEM specifications. Each tool is provided with a source inspection at our Chandler, Arizona facility, and is packaged with installation and warranty support.
Axus maintains an inventory of processing tools available, which are refurbished and configured to customer specifications.
CMP Tools:
IPEC 472 and IPEC 372M
IPEC 776, Orbital Polisher
Applied Materials Mirra
Strasbaugh 6DSSP
Strasbaugh 6EC
Post-CMP Cleaning Tools:
OnTrak DSS 200 - series 0, 1, and 2
Wafer Grinding Tools:
Strasbaugh 7AF
Strasbaugh 7AA
Disco DFG841
Additionally, all tools can be configured to accommodate various materials, as well as various substrate shapes and sizes.

CMP TOOLS, CLEANING EQUIPMENT AND WAFER GRINDING TOOLS
Axus Technology maintains an extensive catalogue of spare parts and assemblies for the support of CMP tools, post-CMP cleaning equipment and wafer grinding tools. Many of these parts have been provided by the original equipment manufacturer.
The broad array of available parts includes various consumable parts. Parts and assemblies are new and configured specifically for use with these tools.
The technical support team at Axus is composed of engineers and technicians with extensive OEM experience. Axus offers a variety of support programs, including on-call support, service contracts and periodic maintenance programs. The Axus Technology team can also refurbish and upgrade customer tools in our Chandler, Arizona facility.

nTellect 200mm Wafer Grinder

2008-06-28T03:48:00.000-07:00

Advanced Wafer Grinding for Semiconductor, Data Storage, SOI, LED, and R&D

The first to introduce a fully-automatic infeed rotary surface grinder for semiconductor wafers, Strasbaugh continues its leadership with the unique nTellect® wafer grinder.

nTellect Benefits
Reduced sub-surface damage
Improved surface finish
Repeatable thickness control
Low cost
Well-suited for a broad range of applications, including hard materials

nTellect Technologies
Tapeless BackgrindingTM
In-feed technology
In-situ thickness control
Force adaptive grinding
Linear traversing grind spindles
Automated process control
Thin wafer handling

nTellect Applications
Integrated Circuit Backgrinding
SOI (Silicon on Insulator)
Prime Wafers
GaAs (Gallium Arsenide)
LiNbO3 (Lithium Niobate)
AlTic (Aluminum Titanium Carbide for Read/Write Heads)
Glass
Sapphire
Quartz

Reduced Sub-Surface Damage
Strasbaugh's innovative nTellect Grinder incorporates near-frictionless, force-sensitive infeed mechanics with an intelligent control system. Rather than force-feeding the grinding wheels at fixed feed rates, nTellect's force adaptive, infeed system design allows the grinding wheel dynamics to determine the precise stock removal rate. This increases wafer strength and reduces wafer breakage.

Improved Surface Finish
nTellect's ultra-stiff air bearing spindles, sub-micron feed rates and rigid tool construction make mirror finishes possible. Combine this with Strasbaugh's complete selection of advanced diamond wheels, and users can achieve the surface finish required for their specific process.

Repeatable Thickness Control
nTellect's in-situ digital measurement probes provide real time thickness measurements to the intelligent control system. The effects of thermal expansion and diamond wheel wear are eliminated, thus ensuring accurate, consistent wafer thicknesses, which eliminates costly re-work.

Linear Traversing Grind Spindles
The unique linear traversing grind spindles alternate between coarse grinding, dual grinding, and fine grinding. The grind spindles move on precise, preloaded roller bearings that provide smooth, rapid motion. The wafer remains on the same work spindle during grinding to reduce wafer handling and optimize throughput.

State-of-the-Art Technologies
nTellect is now offered with two new technologies: Tapeless Backgrinding and ultra-fine grit grind wheels. Tapeless Backgrinding eliminates the need for tape and dramatically reduces grinding costs. The ultra-fine grit grind wheels enhance die strength and improve surface finish, making them well-suited for the most demanding thin wafer applications.

Select Coat® SL-940E

2008-06-28T03:26:00.000-07:00

Powerful Process Control for Conformal Coating

Asymtek’s Select Coat® 940 Series conformal coating system is designed to provide the highest quality and productivity for automated coating processes.
The SL-940E is a high-speed, high-accuracy coating system with integrated, closed-loop process control that ensures superior coating quality. Process parameters are recorded and traceable through Easy Coat® (ECXP) software running on Windows® XP operating system.
Fluid and air pressure are set and monitored through software-controlled electronic regulators. A complete process history can be maintained in ECXP log files for these critical parameters.
A wide range of process parameters can be monitored for statistical process control, including Asymtek’s Laser Fan Width Control, Viscosity Control System, Bar Code System, and Flow Monitoring. The processes are automatically maintained within limits and process status is logged for traceability. This information can be exchanged with customer-specific Factory Information Systems (FIS).

ECXP software, together with an optional vision system, makes teaching your coating program much easier. Pattern recognition software is also available.
Productivity is maximized with ECXP software and machine design. The SL-940E system operates at 1g peak accelerations, is capable of velocities of 1 meter per second, and can accommodate product sizes up to 500 mm.
The SL-940E system has been independently tested and certified for compliance with relevant safety standards including CE and SEMI.

Features

- High-speed, high-accuracy coating system delivers higher productivity
- Powerful process controls ensure coating quality, such as Fan Width Control that automatically adjusts for viscosity variations during the coating process
- Advanced monitoring provides traceability
- Programming is made easier with the optional camera and pattern recognition system
- Downdraft ventilation provides an efficient path for VOC removal
- Designed with stainless steel surfaces, the system is easy to clean and resistant to strong agents
- Integrated electronic controls and software for a wide variety of Asymtek applicators

DataCon 2200

2007-09-23T09:45:00.001-07:00

The 2200 apm Multi Chip Die Bonder is the current industry standard based on Datacon's previous PPS 2200 Multi Chip Die Bonder platform, a revolutionary modular system introduced in 1995. The Datacon 2200 apm provides users with extraordinary flexibility with minimum space requirements. Whatever connection technologies you choose (flip chip, die attach, or a combination of both) the conversion between different applications is done fast and simply. The 2200 apm was developed specifically for the demanding advanced packaging market.

Flip Chip

2007-09-15T10:39:00.000-07:00

WHAT IS FLIP CHIP?

Flip chip microelectronic assembly is the direct electrical connection of face-down (hence, "flipped") electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. In contrast, wire bonding, the older technology which flip chip is replacing, uses face-up chips with a wire connection to each pad.

Flip chip components are predominantly semiconductor devices; however, components such as passive filters, detector arrays, and MEMs devices are also beginning to be used in flip chip form. Flip chip is also called Direct Chip Attach (DCA), a more descriptive term, since the chip is directly attached to the substrate, board, or carrier by the conductive bumps.

IBM introduced flip chip interconnection in the early sixties for their mainframe computers, and has continued to use flip chip since then. Delco Electronics developed flip chip for automotive applications in the seventies. Delphi Delco currently places over 300,000 flip chip die per day into automotive electronics. Most electronic watches, and a growing percentage of cellular phones, pagers, and high speed microprocessors are assembled with flip chip.

Worldwide flip chip consumption is over 600,000 units per year, with a projected annual growth rate of nearly 50% per year. Semiconductor manufacturers currently bump for flip chip assembly about 3% of wafers produced, and are expected to be bumping 10% within a few years.

Fine Pitch Au Wire Bonding

2007-03-17T03:31:00.000-07:00

Fine Pitch Au Wire Bonding

Application:

Fine pitch wire bonding for bonding high density die is measured in pitch. This is a pitch that every year gets a little smaller. The limiting factor on the Palomar Model 8000 is generally the capillary. The model 8000 can bond with as little as 4 grams of force! This high

resolution control of bond parameters is what makes fine pitch wire bonding smaller each year.
The SEM photo shows wires bonded at 50 um pitch and the ball is only 30 um.

Requirements

Model 8000 Wire Bonder

Specifications
Wire = .6 mil (15 um) 99.99 Au
Capillary = GAISER 1800 UFAB series
Temperature = 150 C
Picture Magnification = x600
Ball Diameter = 30 um
Ball height = not measured
Shear strength = not tested
Pitch = 50 um

Stacked Packages Get Thinner

2007-02-15T09:21:00.000-08:00

by John Baliga, Contributing Editor --
document.write(get_publication('Semiconductor International'));
Semiconductor International, 11/1/2006

Many methods for stacking die have been employed in the name of miniaturization, especially for mobile applications. Stacked package arrangements give the advantage of assembling die that have been tested and burned in as packaged devices. Tessera (San Jose) has been developing a new contact for its stackable package to reduce its height. Some of the details of this microcontact array technology were revealed in a paper presented at this year's SMTA International Conference

The micro contacts themselves are <150 µm high and have a conical profile. They are ~100 µm wide at the base and 80 µm at the tip, with a slightly narrower neck. The small diameter makes it possible to pack more contacts into the same area. Another advantage being emphasized is the ability to route more wires between two contacts for a given pitch. In addition to using them for memory stacks (Fig 1), the company has explored their use with system-in-a-package (SiP) applications.

Two keys for this contact to be practical are high coplanarity and the conical shape. Both of these are achieved by etching the contacts out of a sheet of copper. From a material usage standpoint, this might seem wasteful. However, this may be the least costly way to make contacts of this size with the desired profile and coplanarity.

There are two basic process flows, but they both start with a sheet of copper foil that can be up to 120 µm thick. A thin (1 µm) layer of nickel is plated on top, followed by 9-18 µm of copper. The substrate traces are etched out of the thinner copper layer, and the microcontacts are etched out of the thicker copper layer.

For the “contact in” process, the microcontacts are formed first using a two-stage subtractive approach. An aggressive etch removes most of the material, and a more controlled etch produces the final contacts. A 25 µm thick dielectric sheet is added, in which holes were made using a punch or laser ablation process.

After bonding the dielectric, both sides are coated with photoresist. This protects the contacts while the circuit features are being etched from the other side. After the circuit traces are etched out, the dielectric is exposed on the circuit side. An overcoat is applied to the circuit side to protect both the dielectric and the circuit traces, and contact holes are left for first-level bonding. After removing all of the photoresist, a gold-on-nickel barrier is plated onto the microcontacts.

The “contact out” process is similar, though the circuit traces are etched out first, with the nickel layer acting as an etch stop. It requires a dielectric film to be attached to the circuit side before the contacts are formed. Having this dielectric film on the circuit side allows the circuit side to be used as a “board” for the next device to be bonded on top.

In the attachment process for a packaged device, whether it be to the board or to another packaged device, the microcontacts are placed on top of printed solder. Attachment and reflow occur simultaneously. When packages are stacked, the attachment is done in one step. This process has more effective centering that occurs with solder-to-solder attachment. The shape of the microcontact helps maintain alignment because the solder surrounds the pins and pulls it to its center. Once the solder melts over the flared end, the solder may actually help to anchor the contact in place.

In addition to leaving more room for circuit traces, this contact technology can greatly reduce overall package height. A typical four-layer package stack using the company's µZ package might have an overall height of 2.3 mm. Using microcontacts, that height can be as small as 600 µm (Fig. 2 ).

2. Microcontacts make it possible to create package stacks with overall heights less than that a millimeter. (Source: Tessera)

This level of height reduction is comparable with wire-bonded die stacks. The ability to stack devices that can be tested and burned in as packaged devices is considered to be an additional advantage because socketless testing can be performed.
As the drive to miniaturize continues, minimalist approaches to packaging technology, such as this one, can be of great value.

Find more information on semiconductor packaging.

Equipment Use in Front of Line

2007-02-10T07:23:00.000-08:00

In Front of Line (FOL), there are three main process to assemble the unit package. The main process are:

1. Die Preparation (Die prep)

2. Die Attach (DA)

3. Wire Bond (WB)

In Die prep area, there are three main process.

1. Wafer Back Grinding

2. Wafer Mount

3. Wafer Saw.

Die Attach Equipment.

There are so many type die attach equipment in the market. The famous die attach equipments are ESEC, ALphasem, ASM, Renesas and Panasonic.

Renesas Die Bonder DB-730AC

ASM Die Bonder AD898

ESEC Die Bonder 2008

Wire Bonder Equipment

There are so many wire bonder equipment in the market. The famous wire bonders are KNS, ASM, KAIJO.

KNS1488turbo

KNS Maxum

ASM AD339Eagle