Saturday, March 17, 2007

Fine Pitch Au Wire Bonding

Fine Pitch Au Wire Bonding
Application:

Fine pitch wire bonding for bonding high density die is measured in pitch. This is a pitch that every year gets a little smaller. The limiting factor on the Palomar Model 8000 is generally the capillary. The model 8000 can bond with as little as 4 grams of force! This high
resolution control of bond parameters is what makes fine pitch wire bonding smaller each year.
The SEM photo shows wires bonded at 50 um pitch and the ball is only 30 um.


Requirements
Model 8000 Wire Bonder
Specifications
Wire = .6 mil (15 um) 99.99 Au
Capillary = GAISER 1800 UFAB series
Temperature = 150 C
Picture Magnification = x600
Ball Diameter = 30 um
Ball height = not measured
Shear strength = not tested
Pitch = 50 um